Daniel Lewis is a Principal Engineer at Qualcomm, where they have been involved in KGD memory product and test engineering since 2011. Prior to this role, Daniel worked at Micron Technology as a Product Engineer from 2004 to 2011, and as a Test Engineer from 2001 to 2004. Daniel earned a Bachelor of Science in Computer Engineering from Walla Walla College between 1997 and 2001.
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