Daniel Stan is an experienced Principal Engineer at Qualcomm, where they have been contributing since 2012. With a strong background in the wireless industry, Daniel has expertise in Digital Signal Processing, Hardware Architecture, Application-Specific Integrated Circuits (ASIC), and System on a Chip (SoC). Prior to their current role, they held various engineering positions, including Principal Engineer VDSP at STMicroelectronics and Genesis Microchip, and ASIC Design Engineer at Scientific Atlanta. Daniel earned a Master of Science in Electrical Engineering from Georgia Institute of Technology and an Engineer's degree in Electronics and Telecommunications from Universitatea „Politehnica” din București.
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