Davis Lu is a Senior Manager at Qualcomm, where they lead teams in the development of RF modules and packaging technologies since 2016. Previously, they served as R&D Director at Taiji Suzhou Semiconductor and held various roles at AMD, including Senior Package Development Engineer, contributing to new product development and process engineering. Davis holds a Bachelor’s degree in Material Science from Chongqing University and a Master's in Electrical and Electronics Engineering from Soochow University. They possess extensive experience in signal integrity, power integrity, and advanced packaging solutions, having been awarded two patents related to package EMI shielding and improvement.
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