Edward Reyes

Edward Reyes is currently the Director of Automotive Module Engineering at Qualcomm, where they lead the development of automotive packaging solutions. Previously, they served as the Director of Package Applications at Micron Technology, overseeing the LPDRAM development for various customers, and as Director of Engineering at Qualcomm, where they developed innovative packaging for mobile chipsets. Edward's career commenced at Motorola, where they conducted failure analysis and package engineering for CMOS logic products. They possess a Master of Science in Materials Science & Engineering from Stanford University and a Bachelor of Science in Mechanical Engineering from UC Santa Barbara.