Fu Dengke is an experienced engineering professional with a strong background in testing and development within the semiconductor industry. Currently serving as a Staff Test Development Engineer at Qualcomm since June 2011, Fu has previously held roles as a Testing Engineer at Montage Technology, Inc. and an IC Testing Engineer at Conexant Systems Inc. Additionally, Fu worked as an NPI Testing Engineer at Freescale Semiconductor. Educationally, Fu holds a Bachelor of Science degree in Electronic Science and Technology from Tianjin University of Technology and a Master of Science degree in Semiconductor from Zhejiang University.
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