Jay Salmon

Jay Salmon is an experienced professional in the field of integrated circuit (IC) packaging, currently serving as Director at Qualcomm since April 2017. Previous roles include Principal Manager at Cascade Microtech and Director of Packaging and Assembly at Akustica Bosch Group, where significant achievements included the development of packaging technology roadmaps and management of global packaging personnel. Jay's career also encompasses positions at Focus Enhancements, Credence, and Triquint Semiconductor, focusing on RF packaging, product development, and test engineering. Educational credentials include both Bachelor’s and Master’s degrees in Electrical and Electronics Engineering from Auburn University.