Jill N. is a Senior Packaging Engineer at Qualcomm, where they focus on Automotive NPI. They previously held positions as both a Senior Engineer and an NPI Packaging Engineer at the same company and gained valuable experience as a Package Engineering Intern. Earlier in their career, Jill interned as a FAB Process Engineer at Cree, where they led significant projects in wafer fabrication and promoted discussions on diversity in the workplace. Jill graduated from North Carolina State University with a Bachelor of Science in Materials Engineering.
Location
San Diego, United States
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