Junjing (Jerry) Bao is a Principal Engineer at Qualcomm since April 2014, focusing on technology innovation and future product development. Prior experience includes roles as a Sr. Staff Engineer at Qualcomm, specializing in EUV, interconnect architecture, design technology co-optimization (DTCO), and new product introduction (NPI), as well as a Staff Engineer at IBM from June 2008 to April 2014, serving as an Advisory Engineer with expertise in 45/22nm back-end-of-line (BEOL) integration, airgap, eFuse, design for manufacturability (DFM), and competitive analysis. Junjing Bao's academic background includes a PhD in Physics from The University of Texas at Austin and a BS in Applied Physics from the University of Science and Technology of China. Research work at The University of Texas focused on the interaction between plasma and low-k dielectric materials. Summer internships at IBM provided practical experience in 45nm and 65nm BEOL integration.
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