Karan Punj is an experienced Lead Design Engineer currently at Qualcomm since January 2025, previously serving as a Lead Design Engineer and Senior Design Engineer at NXP Semiconductors from April 2024 to January 2025, and gaining extensive experience as an ASIC Digital Design Engineer at Synopsys Inc from June 2019 to December 2020. Initial experience includes an internship at Analog Devices in early 2019 focused on SPI protocol RTL. Karan's expertise encompasses digital IP design, physical layer validation, SDC constraint management, and collaboration with verification teams. Karan holds a B.E. in Electrical, Electronics, and Communications Engineering from Thapar Institute of Engineering and Technology, completed in 2019.
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