Lee Brandon is a Principal Engineer at Qualcomm, where they have been involved in packaging NPI development and new technology characterization since 2021. Prior to Qualcomm, Lee worked as an Engineering Manager at Amkor Technology, Inc. from 1998 to 2005, focusing on packaging engineering and quality management. Earlier experience includes serving as a Product Engineer at CoreLogic, specializing in ISP, audio, and video chip quality management from 2005 to 2006. Lee holds a Bachelor's degree in Electrical Engineering from 광운대학교 and a Master's degree in Management of Technology from 고려대학교.
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