Mario Dai

Mario Dai is a Qualcomm Project Management Director specializing in semiconductor technology strategy and global product commercialization. They have successfully led the Snapdragon 3D acoustic fingerprint technology from concept to a $450 million industry standard, integrating it with AR/VR, autonomous driving, and 5G ecosystems in major terminals like Samsung and Huawei. Previously, they served in engineering and management roles at companies including Apple and Corning Incorporated, where they developed award-winning products and enhanced manufacturing processes. Mario holds a Master’s degree in Materials Science from Caltech.