Mengze Sha is a Senior RF Hardware Engineer at Qualcomm since August 2021, following tenure as an RF Engineer with the same company from June to August 2020. Prior experience includes roles at the University of Illinois at Urbana-Champaign from September 2016 to August 2021, where Mengze served as a Graduate Teaching and Research Assistant and a lead Teaching Assistant for ECE 445, managing engineering design projects. Additional responsibilities involved undergraduate research on microstrip antennas and optical data analysis. Mengze holds a Master of Science in Electrical, Electronics and Communications Engineering and a Bachelor of Science in Electrical and Electronics Engineering, both from the University of Illinois Urbana-Champaign. Previous internship experience includes hardware design for high voltage systems at LifeFoundry, Inc.
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