德馨 邱 is a Principal at Qualcomm, specializing in advanced node enablement and product yield improvement for mobile and PC technologies from 4nm to 2nm. They have 13 years of experience at TSMC in process R&D, focusing on various technology nodes, including 28nm, 16nm, and 7nm, along with automotive IC process integration. 德馨 obtained a Master’s degree in Electronic Physics from National Chiao Tung University and another Master’s degree in Technology Management from National Tsing Hua University.
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