Ragavan Paramasivam is a Hardware Engineer at Qualcomm, specializing in Hardware Baseband Systems since 2022. They hold a Master of Technology in Integrated Circuits and Systems from the Indian Institute of Technology, Madras, where they are currently studying, and previously earned a Bachelor of Engineering in Electronics and Communication Engineering from Sri Venkateswara College of Engineering in 2018. Ragavan has extensive experience in SOC Pinmap design, high-speed board design for both commercial and defense applications, and control system design for gimbals. Additionally, they completed an internship at RMG Electromech (P) Ltd, focusing on power systems design and capacitive coupled resistivity measurement techniques.
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