Sangchol Lee

Sangchol Lee holds a Bachelor of Engineering and a Master of Engineering in Electrical and Information Communication Engineering and Information and Telecommunication Engineering, respectively, from Hoseo University. An accomplished engineer, Sangchol's career began at Silicon Image Works in 2005, followed by roles at Advanced Digital Chips Inc., Chips&Media, Newracom/Newratek, and currently as a Senior Staff Engineer at Qualcomm since August 2017. Expertise includes RTL design in the Hexagon Processor team, development of the world's first IEEE 802.11ah Wi-Fi chipset, and pioneering work on the first hardware HEVC decoder IP. Additional accomplishments encompass advancements in low-power SoC design, embedded processor logic, and enhanced systems integration and verification methodologies across various projects.