Shin C.

Shin C. is a highly skilled thermal engineer with extensive experience in integrated circuit packaging. At 美商高通國際股份有限公司, Shin serves as a Senior Thermal Engineer, contributing to the establishment of the IC packaging thermal team and advancing multiphysics simulations. Previously, at TSMC, Shin was an R&D Engineer who founded the thermal team in the CPI department and developed thermal capabilities from inception to implementation, supporting high-performance computing IC designs. Shin's career began as a Mechanical Engineer at Foxconn, an early-stage startup, and included an internship at Corning Incorporated, where Shin conducted numerical analysis for inspection devices. Academic credentials include a Master’s degree in Mechanical Engineering from Northeastern University and a Bachelor’s degree in Mechanical Engineering from Tatung University.