Ying Duan

Ying Duan is a Principle Engineer and Manager at Qualcomm, where they lead projects focusing on Die to Die Link and SERDES technologies. With a robust background spanning over 13 years in mixed-signal design, they have contributed to various challenging projects, ranging from high-speed interfaces to complex analog components. Their previous roles include positions at Silicon Image, Trident Microsystems, and Aviacomm, where they excelled in design engineering and team leadership. Ying holds a Bachelor of Science in Electronic Information Engineering from Hangzhou Dianzi University and a Master's degree in Circuit and System from Shanghai Jiao Tong University.