Robert Driscoll

Packaging Engineer at Quantum-Si

Robert Driscoll has worked as a Packaging Engineer at Quantum-Si since November 2020. Prior to that, they worked as an Undergraduate Researcher and Research Assistant at UConn Health from May 2018 to August 2018. In 2019, they worked as a Device Engineer at the University of Connecticut from May 2019 to August 2019.

Robert Driscoll attended the University of Connecticut from 2016 to 2020, where they pursued a degree in Biomedical Engineering with a focus on Bioinstrumentation.

Links

Timeline

  • Packaging Engineer

    November, 2020 - present