Ranjith Kumar is a Senior Engineer at Radisys Corporation since January 2023, specializing in 5G Distributed Unit engineering. Prior to this role, Ranjith gained valuable experience as a Real Time Embedded Engineer and Junior Real Time Embedded Software Engineer at Airspan Networks from July 2020 to January 2023, focusing on LTE and 5G L2/L3 layers while also understanding 3GPP specifications. Ranjith began the career as an Embedded Software Engineer at Lekha Wireless Solutions Pvt. Ltd. from March 2018 to July 2020, working on LTE L2 technologies including SCQPSK and SOQPSK. Ranjith holds a B.Tech degree in Electronics and Communication Engineering from Madanapalli Institute of Technology & Science, obtained in 2017.
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