Cheng-Yu Chen is the Deputy Director of Smart Interconnection Business at 瑞昱半導體股份有限公司, a position held since 2024. Previously, Cheng-Yu served as Director at 合肥沛睿微电子股份有限公司, overseeing chip development for server infrastructure from 2023 to 2024. From 2019 to 2023, Cheng-Yu was a 部經理 at 宏芯宇電子股份有限公司, leading research and development teams focused on SSD products across multiple locations. Cheng-Yu's early career at 瑞昱半導體股份有限公司 included various roles in product development and management from 2012 to 2014 and earlier experience as an engineer at Winbond in 2007. Currently, Cheng-Yu is pursuing studies at 國立臺灣大學, expected to graduate in 2025.
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