Wayne Cheng is currently a Senior Engineer at 瑞昱半導體股份有限公司, where they apply their extensive experience in production test process improvement and troubleshooting. Previously, they served as a NPD Staff Product Engineer at 安森美半导体 from 2020 to 2025, managing production data and enhancing yield performance. Wayne has also held significant roles, including Deputy Manager at 京元電子股份有限公司 and Senior Product Engineer at 虹冠電子(Champion Micro Corp.), contributing to new product introductions and production efficiencies. Wayne earned a Bachelor's degree in Electric Engineering from 中原大學 and a Master's degree in Electric Control Engineering from 國立交通大學.
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