REB Semiconductor is a professional semiconductor packaging equipment solution provider in China, dedicated to R&D, manufacturing, and commercialization of advanced semiconductor packaging equipment. Founded in 2012, our company is headquartered in Shenzhen, China, with R&D centers in Hong Kong and Malaysia, and a comprehensive global service network spanning Asia and North America.
REB Semiconductor focuses on core processes in advanced packaging, offering a product portfolio that covers COB, COC, TO, and power module platforms. Our key capabilities include high-precision die bonding, eutectic bonding, and ultrasonic welding technologies.
Through continuous innovation, rigorous engineering standards, and a robust quality management system, REB Semiconductor delivers high-precision, reliable, and production-proven equipment to the industry. Our solutions serve a wide range of applications, including optical communications, laser devices, power semiconductors, and automotive electronics—supporting the global advancement of digitalization and intelligent manufacturing in semiconductor packaging.
Today, REB Semiconductor is firmly established in the core supply chains of most of the world's top 10 optical transceiver manufacturers. We have forged deep co-development partnerships with tier-one clients to jointly drive equipment and process innovations for next-generation optical modules.

REB Semiconductor

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REB Semiconductor

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