Eric Gelvin is a Principal Package Design Engineer at Renesas Electronics, a position they currently hold. Previously, Eric worked as a Member of Technical Staff in Package Development at ON Semiconductor and served in various engineering and management roles at companies including NXP Semiconductors, UGS America Sales Inc., Freescale Semiconductor, and Intel Corporation. Eric has a solid academic background, holding a Master's degree in Statistics and a Bachelor's degree in Mechanical Engineering from Arizona State University.
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