Michael Oppenheim

Associate Director, Global Package Engineering at Repligen

Michael Oppenheim has a diverse work experience in package engineering and management. Michael currently works as an Associate Director of Global Package Engineering at Repligen Corporation since May 2023. Prior to that, they held various positions at EMD Millipore, including Head of Packaging Technology Global and Global Packaging Engineer/Commodity Manager, from March 2008 to the present. Michael also served as the Corporate Package Engineering Manager at Unicorr Packaging Group from 2001 to 2008. Before that, they worked as a Package Engineer/Manager at Smurfit Stone Corp from 1994 to 2001 and as an Industrial Designer at Arthur D Little from 1991 to 1992.

Michael Oppenheim earned a Bachelor of Science (BS) degree in Industrial Design from Wentworth Institute of Technology, which they attended from 1990 to 1993. Prior to that, they obtained an Associate of Science (A.S.) degree in Mechanical Design from the same institute, attending from 1988 to 1990. There is no available information regarding their education at King Philip.

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Timeline

  • Associate Director, Global Package Engineering

    May, 2023 - present