Daniel Wei

Daniel Wei is an experienced Senior Electronic Engineer currently at Resideo since May 2025, previously holding positions as a Custom Product Design Engineer at Rakon (2022 - 2024) and an Electronic Engineer at IMAGR (2019 - 2022). Daniel's earlier career includes roles at Huawei Technologies from March 2010 to June 2017 as a Network Solutions Consultant and System Engineer, focusing on end-to-end network solutions, project bidding, and technical planning for microwave transmission. Prior to Huawei, Daniel worked at Comba Telecom (June 2007 - January 2010) as a Hardware Engineer, where responsibilities included RF module development for 3G base stations and circuit design. Daniel holds a Master’s degree in Electrical and Electronics Engineering from the University of Auckland (2018 - 2019) and a Bachelor's degree in Electrical, Electronics and Communications Engineering from the University of Electronic Science and Technology of China (2003 - 2007).