Yesusa Collantes is a Lead RnD Process Engineer in Advanced Packaging at Rigetti Computing, where they focus on bonding technologies for superconducting QuICs in quantum processors. Previously, Yesusa served as a Technology Development Engineering Manager and Senior Packaging R&D Engineer at Intel Corporation, managing equipment maintenance and process development. Yesusa has a strong academic background, holding a Master's degree in Physics from the University of Puerto Rico-Mayaguez and a PhD in Material Science and Engineering from Florida State University. They also held the position of Professor of Physics at the National University of Trujillo in Peru.
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