Allan Eagan is a seasoned engineering professional with extensive experience in packaging and product engineering. Currently serving as Packaging Engineer II at Rochester Electronics, LLC since March 2021, Allan leads cross-functional teams to fulfill customer and supplier requirements efficiently. Prior roles include Engineer I at ATI, where responsibilities included managing engineering drawing packages and maintaining project databases, and various positions at Teradyne, BuroHappold Engineering, SIG SAUER, Inc., and SBB Daldrop LLC, focusing on engineering processes, manufacturing operations, and design assistance. Allan holds a Bachelor of Science in Mechanical Engineering from Wentworth Institute of Technology, earned in 2017.
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