Dan Deisz

Dan Deisz has extensive experience in semiconductor design and technology, currently serving as Vice President of Design Technology at Rochester Electronics, LLC since March 2008. In this role, Dan manages a team focused on porting semiconductor products between fabrication processes and ensuring successful duplication for original manufacturers and customers. Previous experience at LSI from May 1987 to February 2008 includes roles such as Director of Technology Marketing, where Dan coordinated IP development based on customer feedback, and Director for ASIC technical presales in both North America and Europe. Earlier in Dan's career, experience as a Design Engineer at Harris Corporation involved early ASIC developments for secure communications. Dan holds a BSEE in Digital Design from The University of Alabama and studied at Northern Illinois University.