원호 최 is an Advanced Packaging (WLFO/PLFO) Engineer with extensive experience in wafer-level advanced packaging and bumping process development. They have held significant roles at Amkor Technology, Inc., where they served as both a Customer Project Leader and Bumping Process Section Leader, achieving high yield requirements and successful technology development. Previously, 원호 worked at Atotech Group as a Plating Chemical Process Engineer and at Applied Materials as a Samsung Account Planner. They hold a Bachelor's degree in Electronic Information Engineering from 고려대학교. Currently, 원호 is a Staff Engineer in the Semiconductor Processing Development APD Lab at 삼성전자.
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