Seungjun Lee has a robust background in mechanical engineering, holding a Doctor of Philosophy (Ph.D.) from 서강대학교, along with a Master's and Bachelor's degree from the same institution. Lee's professional experience includes a postdoctoral position as a Research Associate at the University of Illinois at Urbana-Champaign, focusing on nanocrystal-based electronics and perovskite technologies. Since October 2016, Lee has been employed at Samsung Electronics, progressing through roles from Senior Engineer to Staff Engineer, and is currently serving as a Principal Engineer as of March 2024, specializing in Chemical Mechanical Polishing (CMP).
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