Dr. Yan Li is a Principal Engineer at Samsung Semiconductor, specializing in advanced packaging solutions. With a nearly 20-year career at Intel and Samsung, they have demonstrated expertise in failure analysis, reliability assessment, and program management. Dr. Li holds a Ph.D. in Materials Science and Engineering from Northwestern University and has co-edited three recognized books while publishing over 30 papers and holding six patents in microelectronic packaging. They have successfully led projects in 2.5D and 3D packaging technology development, influencing the semiconductor industry through active participation in professional societies.
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