At Saras Micro Devices, we are transforming the way power is delivered to advanced semiconductor devices to maximize the computing power for cutting-edge, data-intensive applications like high-performance computing (HPC), artificial intelligence (AI), machine learning (ML), virtual reality (VR), 5G networking and more. 

As packaging experts in the IC world, we understand your power delivery challenges and the technology behind them, and we’ve created a new way to power your innovations. Our novel approach for improving power delivery performance uses 25% less package space, provides clean stable power, and minimizes power waste to deliver better overall efficiency.

When you need packaging expertise to help you reach your power management goals, let us help you power the future. 

Packaging Services

Semiconductor

Saras Micro Devices

Saras Micro Devices' headquarters in Chandler, AZ, United States

Ron Huemoeller

Margaret Hanawalt

Jonathon Greenwood

Tiyada Baldwin-Barnes Mls

Eelco Bergman

Richard Sheridan

The Engineering Team at Saras Micro Devices is responsible for the design, development, and optimization of advanced power delivery solutions for high-performance semiconductor devices. This includes creating innovative IC packaging methods that enhance power efficiency, minimize waste, and optimize package space. The team comprises experts in electrical testing, microelectronics, industrial processes, R&D, and advanced processes, ensuring cutting-edge solutions for applications in AI, ML, VR, HPC, and 5G networking.

Engineering Team

The Leadership Team at Saras Micro Devices is responsible for guiding the overall strategic direction of the company. This team, comprising the VP of People & Culture, President & CEO, Chief Development Officer, Chief Business Officer, and Chief Operations Officer, ensures the alignment of organizational efforts to transform power delivery for advanced semiconductor devices. They oversee business operations, drive innovation, manage company culture, and foster partnerships to maximize computing power for applications including HPC, AI, ML, VR, and 5G networking.

Leadership Team

The Engineering and Product Development team at Saras Micro Devices is responsible for innovating and designing advanced power delivery solutions tailored for high-performance computing (HPC), artificial intelligence (AI), machine learning (ML), virtual reality (VR), 5G networking, and other demanding applications. The team leverages their expertise in advanced heterogeneous integration and packaging to develop cutting-edge products that minimize power waste, optimize efficiency, and reduce package space by 25%. They collaborate closely to address complex power delivery challenges, ensuring that our solutions consistently meet the needs of the most advanced semiconductor devices.

Saras Micro Devices

Org chart

Teams

Engineering Team

Leadership Team

Engineering and Product Development

Offices

Saras Micro Devices

Org chart

Teams

Engineering Team

Leadership Team

Engineering and Product Development

Offices

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