[Microsection Evaluation]: Automated PTH, Buried, Blind, and Microvia structures. [Spatial 3D Analysis]: Sub-micron resolution of interconnect features, grain structures, resin-to-fiber ratios, and voiding failures. [Compliance Testing]: IPC-TM-650 2.6.8 Thermal Stress & 2.6.27 Reflow Simulation (... Read more
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