PA

Paul Anderson

Sr. Director - Wafer Process Engineering

Paul Anderson is currently the Sr. Director of Wafer Process Engineering at Seagate Technology, where they oversee critical advancements in semiconductor manufacturing. They held several leadership roles at Seagate Technology, including Director of Unit Process Development and Managing Principal Engineer. Prior to their tenure at Seagate, Paul worked as an Engineering Director at Western Digital and served as a Research Assistant at the Naval Research Laboratory. Paul earned a BA in Physics from Kalamazoo College and a Ph.D. in Physics from the University of California, Davis.

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Minneapolis, United States

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