Sheetak Inc.
Dan G. is a seasoned mechanical engineer with extensive experience in thermal analysis, CFD fluid flow simulation, and FEA stress analysis. Currently serving as Principal Mechanical Engineer at Sheetak Inc. since March 2022, Dan G. previously held senior engineering roles at Varian, A Siemens Healthineers Company, and Sheetak Inc. Dan G. has also consulted independently, focusing on transforming innovative concepts into successful products. Past positions include Principal Mechanical Engineer at Aavid Thermalloy and Nuventix, and Senior Mechanical Engineer roles at Nanocoolers and Active Power, contributing to mechanical and thermal design across various projects.
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Sheetak Inc.
Sheetak is leading the charge in integrated solid-state cooling chips that double the operating efficiencies, breaking a five-decade long stagnation in the field. Sheetak is commercializing a unique thin film thermoelectric platform technology culminating from years of innovation in advanced materials, semi-conductor manufacturing, and thermal management. Sheetak is changing the paradigm in solid state electronic cooling and energy harvesting. Efficiency, integration, reliability, and scalability are no longer a limit. Sheetak addresses an abundance of industry challenges with one platform technology. QOOL Chips® enable faster communications, 5G wireless, more reliable medical diagnostics, sustainable and mobile refrigeration. EON® energy harvesting chips allow battery-free Industrial IoT, Building IoT, and Wearables. Sheetak's commitment to you is a Cleaner, Greener, and Cooler Planet Sheetak at a glance: - Truly negative carbon footprint unlike traditional mechanical refrigeration technology - Pioneering thin film solid-state coolers that are 2x more efficient than current technologies - Recipient of over $15mm in competitive Department of Energy and Department of Defense grants - Designed in Austin, TX and Made in America