Lin Chai has a strong background in electrical and electronics engineering, with a Bachelor's degree from Harbin Institute of Technology and a Master's degree from the University of Melbourne. Lin began an internship as an RF Engineer at Siemens Healthineers before transitioning to a role as a Junior Maintenance Engineer at CRRC Corporation Limited. Subsequently, Lin worked as a Junior TCS Engineer at UGL from May 2021 to January 2023 and currently serves as a Solution Engineer at Siemens since January 2023.
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