Dan Leung is an experienced professional in the semiconductor industry with a robust background in assembly and packaging. Currently serving as Sr. Director of NPI at SiFive since June 2018, Dan has also held the position of Director for Assy & Packaging at Open-Silicon since December 2003. Previous roles include Director of Assembly & Packaging at Lightspeed Semiconductor from March 1999 to November 2003, and Manager of Assembly/Packaging at Atmel Corp from 1988 to 1998. Dan began a career in packaging engineering at Advanced Micro Devices and monolithic memories from 1986 to 1989. Dan earned a Bachelor of Science degree in Mechanical Engineering from the University of California, Berkeley, between 1981 and 1985.
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