Michael O. holds a Master’s Degree in Radio Science and Engineering and is recognized as an advanced panel level package process technology expert. They have played key development roles in pioneering semiconductor manufacturing lines, including the world’s first RFIPD and CuP bump technologies. Currently, as a Technical Principal at SILICON BOX, Michael O. is focused on advanced panel level package development and NPI initiatives. Previously, they served as a Senior Technical Director at Amkor Technology, where they managed various innovative technology developments for advanced packaging and manufacturing.
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