Lee Chun Wei is a Staff Circuit Design Engineer with experience in analog circuit design, particularly in memory interface IPs, including HBM3 and DDR5/4. Lee held the position of Senior Circuit Design Engineer at SkyeChip in 2023 and previously worked as a Circuit Design Engineer there. Lee also completed a Student Internship at Osram Opto Semiconductors Malaysia in 2020. Lee earned a Bachelor of Engineering degree in Electronic Engineering from Universiti Malaysia Perlis in 2021, graduating with a CGPA of 3.83.
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