友圣 剡 is an Assistant Director at 中芯国际, where they have been employed since 2002. Prior to this, they worked as a Principal Integration Engineer at United Microelectronics Corporation from 1999 to 2002 and as an Integration Engineer at WSMC and Windbond Electronics from 1997 to 1999. 友圣 剡 earned a bachelor's degree in Engineering Physics/Applied Physics from 中原大学 in 1992 and a master's degree in Applied Physics from 台湾大学 in 1994. They completed their high school education at 师大附中 from 1985 to 1988.
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