Chin Tee

Chin Tee has a diverse work experience in the electronics and semiconductor industries. Chin started their career as an R&D project engineer at FTS, where they focused on designing and developing low temperature mechanical refrigeration chillers and freeze dryers. At inTEST Thermal Solutions, they worked as a project engineer, developing new models and mechanisms for semiconductor industries. Chin then joined Kulicke & Soffa as a Sr. Application Engineer, leading fishbone analysis to resolve test socket failure issues and contributing to a high-volume production that generated $8 million. At Interconnect Devices, Inc., they served as a Field Application Engineer and successfully secured design wins and new business for the company. Currently, Chin is working at Smiths Interconnect as a Sales & Business Development Director, where they implement interconnect solutions and manages the sales team. Overall, Chin has demonstrated expertise in technical consulting, project management, and troubleshooting in the electronics and semiconductor industries.

Chin Tee obtained a Bachelor of Science degree in Mechanical Engineering from the University of Oklahoma from 1996 to 1998. From 1998 to 2000, they pursued a Master's degree in Mechanical Engineering at the University of Tennessee, Knoxville. Additionally, Chin Tee has attended INTI, but no specific degree or field of study was provided for this institution.