Moh Kolb

Moh Kolb is the Senior Director of IC/Packaging at Socionext US, overseeing advanced integrated circuit packaging and design. Previously, they served as Director of Packaging at Socionext USA and led design efforts at Amkor Technology, Inc., where they focused on advanced packaging solutions for top-tier clients like Intel and Qualcomm. Moh's career includes significant contributions to Qualcomm as a Senior Staff member and to Intel Corporation as a Staff Architect, where they were recognized for pioneering packaging innovations. They are currently pursuing a Doctor of Philosophy in Electrical and Computer Engineering at Temple University, holding a Master of Science and a Bachelor of Science in Electrical and Electronics Engineering from the University of Mississippi and Tehran, respectively.