Archana Rajagopal is a Senior Firmware Engineer at Solidigm since December 2021, offering extensive experience in firmware development and validation. Previous positions include various engineering roles at Intel Corporation from May 2013 to December 2021, where responsibilities spanned SSD firmware engineering and validation. Earlier career experiences include roles as a Test Software Engineer at SynapSense Corporation, a Software Engineer at Dorado Software, and a Software Engineer at Infosys. Archana holds a Master’s degree in Computer Systems Networking and Telecommunications from North Carolina State University and a Bachelor’s degree in Electrical, Electronics and Communications Engineering from PSG College of Technology.
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