Asim Khan

Asim Khan serves as the Vice President of Hardware Engineering at Solidigm since December 2021, previously holding the position of Senior Director of Hardware Engineering. Prior to Solidigm, Asim Khan spent over 24 years at Intel Corporation, where titles included Senior Director of Engineering, managing the Non-Volatile Memory Solutions Group's global Platform Hardware & Packaging organization, and roles such as Engineering Program Manager and Chipset Package Platform Manager. Asim Khan's earlier experience includes packaging engineering at Ross Technology, Inc. and test engineering for FPGAs at Actel (now Microsemi). Academic qualifications include a Master’s degree in Manufacturing Systems Engineering from The University of Texas at Austin, an Executive MBA from California State University-Sacramento, and a Bachelor's degree in Electrical Engineering from The University of Texas at Austin.