Cody Malnor is a Senior Firmware Engineer at Solidigm, contributing to the development of solutions in Flash Translation Layer (FTL) for Solidigm storage products since December 2021. Prior experience includes a role as a Firmware Engineer at Intel Corporation from May 2017 to December 2021, where responsibilities included firmware integration, debugging, and leading a team for firmware packaging tools. Cody's background also features work as a Thermal Engineer at Intel, focusing on thermal aspects of SSD products and developing testing frameworks. Earlier roles included research and development at RTI Surgical and various positions at Northern Michigan University, culminating in dual Bachelor’s degrees in Computer Science and Mechanical Engineering Technology from Northern Michigan University.
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