Danielle Gould is an experienced Application Engineer currently working at Solidigm since December 2021, with a previous position as an Application Engineer at Intel Corporation from January 2020 to December 2021. Danielle also held roles as an SSD Technical Intern at Intel Corporation and as an Electrical Engineering Intern at EM Research, Inc. from December 2018 to December 2019. Prior experience includes serving as a Senior Engineering Technician at Samsung Austin Semiconductor from December 2011 to May 2017 and as a Wafer Fab Technician at Spansion (Cypress Semiconductor) from March 2007 to November 2011. Danielle holds degrees in Electrical Engineering and Computer Science and Engineering from the University of Nevada, Reno, and an Associate of Science degree from Truckee Meadows Community College.
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