Hardeep Singh is an experienced Thermal-Mechanical Hardware Team Manager currently at Solidigm since December 2021, previously holding the same title at Intel Corporation from April 2017 to December 2021. With a solid foundation in thermal analysis and management, Hardeep has led design teams to develop high-volume manufacturing thermal-mechanical hardware solutions for SSDs, emphasizing quality delivery in dynamic environments. Prior roles include Thermal Lead and Sr. Thermal-Mechanical Engineer, where expertise in thermal characterization for IC packages and System-in-Package designs was demonstrated. Earlier experience as a Research Engineer at AltaSim Technologies involved thermal analysis of electronic circuit packages, while a position at General Electric focused on algorithm development for gas turbine diagnostics. Hardeep holds a Master's degree in Heat Transfer and CFD from Arizona State University and a B-Tech in Mechanical Engineering from the National Institute of Technology Karnataka.
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