Kevin Liou currently serves as a Technical Program Manager at Solidigm, a position held since January 2024. Prior to this role, extensive experience was gained at Intel Corporation over a span of 15 years, where responsibilities included leading product development for the 4th and 5th generation 3D NAND, overseeing test chip development for next-generation 3D NAND, managing strategic alliances for external supply agreements, and contributing to product development for the 1st and 2nd generation 3D NAND. Kevin Liou started at Intel as a Product Engineer, focusing on product development for 34nm, 25nm, and 20nm NAND technologies. Kevin Liou holds a degree from the University of California, Davis.
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