Leno Lei Wei is a Principal Process Integration Engineer at Solidigm, where they focus on advanced 3D NAND technologies. Previously, Leno led customer product development as the Yield Lead at Intel Corporation, specializing in advanced FinFET and GAA technology integration. Leno's extensive experience includes roles at Micron Technology, where they directed 3D NAND and 3D XPoint process integration, as well as at GLOBALFOUNDRIES, where they served as the Logic Device Integration Group Leader. Leno holds a dual bachelor's degree in engineering from 西安交通大学 and a master's degree in electrical and electronics engineering from Fudan University.
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