Michael Halpin is an experienced professional in the electronics and technology sectors, currently serving as a Field Application Engineer at Solidigm since January 2022. Prior to this role, Michael held various positions at Intel Corporation, including Technical Solution Specialist within the Non-Volatile Memory Solutions Group from April 2017 to December 2021, where responsibilities included design assistance and customer relationship management. Michael's extensive background also includes over a decade at Hewlett-Packard Enterprise as a Senior Engineering Program Manager for SSD development and qualification, along with previous roles at Hewlett-Packard, Texas Instruments, and E-Systems, showcasing a strong foundation in program management, product development, and engineering across multiple technology platforms. Michael's academic credentials include an MBA in Marketing/International Business from the University of Houston and degrees in Electrical Engineering Technology and Avionics Systems Technology.
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